Technology Transfer, Transition and Commercial Partnerships

Director: Mr. Stephen Luckowski

T3CP Logo

MISSION

DoW T3CP Office has primary responsibility for strategic partnerships and leveraging intellectual property developed (1) at the over 216 DoW labs and, (2) by performers of extramural, DoW-funded R&D, for maximum capability, technology superiority, and economic and national security.

Interagency Communities
Vision
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Led by T3CP, the DoW T2 community is a trusted innovation pathway providing strategic partnerships and leveraging intellectual property for maximum capability, technology superiority, and economic prosperity to benefit the nation.

Transferring DOW IP and capabilities to commercial entities, it makes available innovative products and services for transition into the military services

Legislative Authorities
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Guiding Documents
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T3CP Goals and Associated Strategies
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T3CP Responsibilities
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The Value of IP
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DOW Technology Transfer and Transition (T3CP)

Technology Transfer (T2) Mechanisms – Engaging External Partners
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Federal T2 mechanisms include, but are not limited to:

  • Cooperative Research and Development Agreement (CRADA): R&D collaboration agreement with non-Federal entity covering a defined scope of work; funds may be provided to Government, but Government cannot provide funds to non-Federal entity under a CRADA, includes granting of rights to subject matter inventions
  • Patent License Agreement: licensing of federally owned inventions that may grant non-exclusive, partial, or exclusive rights to make, use, offer to sell, or sell products that include patented invention
  • Educational Partnership Agreement: agreement with educational institutions for enhancing scientific disciplines
  • Partnership Intermediary Agreement: non-profit, state-based partnership intermediary engaging small businesses and academia on behalf of Government to accelerate T2 and transition

For example: DoW TechLink and MilTech

DoW’s National Partnership Intermediaries
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Training Resources

TechLink
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Defense Acquisition University
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U.S. Patent and Trade Office
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